AE-TECH supports electronics protection, thermal-management, bonding and sealing material selection based on component structure, substrates and the operating environment.
Control modules, PCBs, electronic housings and power modules may require different levels of softness, filling behavior, electrical insulation and cure control. Potting, gel, epoxy and polyurethane are not direct substitutes.
Control module
PCB
Electronic housing
Power module
For power electronics, semiconductors, inverters and converters, start with the actual gap, assembly tolerance, hardness and dispensing method.
TCMP 8815
A soft silicone gap filler with 1.5 W/mK thermal-conductivity data on the Product page.
TCMP 8825
A 2.5 W/mK direction that still requires gap, hardness and dispensing-equipment review.
TCMP 8835
A 3.5 W/mK direction for applications requiring higher heat transfer within the same family.
Conformal coating forms a thin film over the PCB. Chemistry, masking, thickness, application and inspection criteria must be defined.
BECOAT 921L
A neutral, one-component, low-viscosity, solvent-free silicone conformal coating.
BECOAT 9060
A transparent one-component coating with a fluorescent indicator to support coverage inspection.
BECOAT 9067
A solvent-containing, moisture-cure, one-component silicone conformal coating.
Pressure, temperature, Hall and automotive sensors require review of sensing geometry, wire bonds, electrical needs, deaeration and thermal load.
Silicone gel
BeGEL 8708, 8710-2 and 8715 are considered where a soft protective layer and stress relief are required.
Potting
BeSIL 8230 and BEEP 6102 represent different material directions; selection depends on hardness, heat and process.
Assembly adhesive
BEEP 629 and 6206 have application evidence for pressure sensors and electronic assemblies; substrates and cure conditions still require confirmation.
Connectors, junction boxes and electrical housings require clear gap, flow-path, electrical-contact, substrate and repairability information.
Connector
Junction box
Electrical housing
IGBTs, power modules, transformers and controllers often need several material functions at once. Evaluate each function separately.
Thermal transfer
Measure the gap, define the heat-sink surface and compare TCMP or another suitable thermal material.
Electronics protection
Select gel, silicone potting, epoxy or polyurethane according to stress, electrical and thermal requirements.
Sealing and fixation
Consider silicone or epoxy adhesives according to location, substrate and production cycle.
Define the component and environment
Clarify assembly structure, substrates, thermal and electrical loads, vibration, humidity and operating conditions.
Define the material requirement
Separate protection, thermal transfer, bonding, sealing or combined functions.
Narrow the material family
Compare potting, gel, gap filler, coating, sealant or assembly adhesive.
Review technical documents
Check data for the exact code, test conditions, packaging, regional SDS and missing information.
Prepare the evaluation
Agree samples, handling and acceptance criteria without treating the trial as production approval.
Each group focuses on one material role and the conditions to verify before selecting a code.
Silicone Encapsulants for Electronic Components organizes verified products and supporting technical records for selection in the relevant manufacturing context.
Related technical information is available
Silicone Gels for Modules and Sensors organizes verified products and supporting technical records for selection in the relevant manufacturing context.
Related technical information is available
Thermal Transfer and Gap-Filling Materials organizes verified products and supporting technical records for selection in the relevant manufacturing context.
Related technical information is available
Conformal Coatings for Circuit Boards organizes verified products and supporting technical records for selection in the relevant manufacturing context.
Related technical information is available
Silicone Adhesives and Sealants organizes verified products and supporting technical records for selection in the relevant manufacturing context.
Related technical information is available
Epoxy and Polyurethane Encapsulants organizes verified products and supporting technical records for selection in the relevant manufacturing context.
Related technical information is available
Epoxy Adhesives for Electronics Assembly organizes verified products and supporting technical records for selection in the relevant manufacturing context.
Related technical information is available
These codes provide initial direction across potting, gel, thermal gap filler, coating, sealant and assembly adhesive; they are not direct substitutes.
BeSIL 8230
BeSIL 8230 is a two-component, addition-cure, thermally conductive RTV silicone. AE-TECH uses this grade as an initial technical candidate for electronic modules, power supplies and control units. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
BeGEL 8708
BeGEL 8708 is a two-component addition-cure silicone gel. AE-TECH uses this grade as an initial technical candidate for igbt, junction box, control units and inverter. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
BESIL TCMP 8825
BESIL TCMP 8825 is a two-component liquid silicone gap filler that is soft and thixotropic. AE-TECH uses this grade as an initial technical candidate for power-electronics equipment and vehicle electronics. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
BECOAT 921L
BECOAT 921L is a one-component, neutral, low-viscosity, solvent-free silicone conformal coating. AE-TECH uses this grade as an initial technical candidate for rigid or flexible PCBs and LCM/LCD edges. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
BeSIL N9339
BeSIL N9339 is a one-component neutral, moisture-cure RTV silicone. AE-TECH uses this grade as an initial technical candidate for electronics housings, control modules and connectors. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
BEEP 6113
BEEP 6113 is a two-component thermally conductive epoxy potting material. AE-TECH uses this grade as an initial technical candidate for automotive electronics, power tools, reactor and measurement equipment. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
BEEP 6206
BEEP 6206 is a two-component transparent structural epoxy adhesive. AE-TECH uses this grade as an initial technical candidate for automotive electronics, pressure sensors, wiring and motor cores. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
Describe the component, operating conditions or technical issue so AE-TECH can prepare the right discussion.
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