BEEP 6113 is a two-component thermally conductive epoxy potting material. AE-TECH uses this grade as an initial technical candidate for automotive electronics, power tools, reactor and measurement equipment. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
BEEP 6113 is a two-component thermally conductive epoxy potting material. AE-TECH uses this grade as an initial technical candidate for automotive electronics, power tools, reactor and measurement equipment. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
Module, transformer, sensors and electrical equipment
Evaluate component encapsulation in the context of Module, transformer, sensors and electrical equipment against the actual material, component, process and operating conditions before standardization.
Manufacturing application
Evaluate fixing and electrical insulation in the context of Manufacturing application against the actual material, component, process and operating conditions before standardization.
Verify material system against the exact Product Code, product-specific documentation and actual application before selection.
Verify mixing requirements against the exact Product Code, product-specific documentation and actual application before selection.
Confirm curing cycle against the product-specific documentation and the actual application before selection.
Prepare the surface, mix and cure in accordance with the product-specific TDS, and test on the actual assembly before introducing the material into the process. Contact AE-TECH to check the SDS applicable to the product and region of use.
| Metric | Value |
|---|---|
| Configuration | A:B = 100:8 by weight |
| Material system | Two-component thermally conductive epoxy potting material |
| Key technical data | 1,0 W/mK |
| Product code | BEEP 6113 |
This information is summarized from manufacturer technical and safety documentation for initial evaluation and does not replace confirmation under actual application conditions.
Epoxy and Polyurethane Encapsulants organizes verified products and supporting technical records for selection in the relevant manufacturing context.
Beginor provides silicone, epoxy, polyurethane and acrylic material technologies for electronics protection, thermal management, bonding and sealing.
7 Product Groups
AE-TECH helps electronics manufacturers evaluate encapsulation, conformal coating, thermal-management, bonding and sealing materials for component and module assembly.
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