Silicone Gels for Modules and Sensors
Silicone Gels for Modules and Sensors organizes verified products and supporting technical records for selection in the relevant manufacturing context.
Beginor provides silicone, epoxy, polyurethane and acrylic material technologies for electronics protection, thermal management, bonding and sealing.
Beginor supplies material technologies for electronics protection, assembly and thermal management. The catalogue includes silicone encapsulants and gels, conformal coatings, silicone adhesives and sealants, epoxy and polyurethane encapsulants, and epoxy adhesives.
These are the main entry points; the Brand catalogue may include additional groups.
Silicone Gels for Modules and Sensors organizes verified products and supporting technical records for selection in the relevant manufacturing context.
Epoxy Adhesives for Electronics Assembly organizes verified products and supporting technical records for selection in the relevant manufacturing context.
Silicone Adhesives and Sealants organizes verified products and supporting technical records for selection in the relevant manufacturing context.
Conformal Coatings for Circuit Boards organizes verified products and supporting technical records for selection in the relevant manufacturing context.
Epoxy and Polyurethane Encapsulants organizes verified products and supporting technical records for selection in the relevant manufacturing context.
Silicone Encapsulants for Electronic Components organizes verified products and supporting technical records for selection in the relevant manufacturing context.
Thermal Transfer and Gap-Filling Materials organizes verified products and supporting technical records for selection in the relevant manufacturing context.
This selection supports initial orientation and does not represent the full catalogue.
BeSIL 8230
BeSIL 8230 is a two-component, addition-cure, thermally conductive RTV silicone. AE-TECH uses this grade as an initial technical candidate for electronic modules, power supplies and control units. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
BeGEL 8708
BeGEL 8708 is a two-component addition-cure silicone gel. AE-TECH uses this grade as an initial technical candidate for igbt, junction box, control units and inverter. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
BESIL TCMP 8825
BESIL TCMP 8825 is a two-component liquid silicone gap filler that is soft and thixotropic. AE-TECH uses this grade as an initial technical candidate for power-electronics equipment and vehicle electronics. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
BECOAT 921L
BECOAT 921L is a one-component, neutral, low-viscosity, solvent-free silicone conformal coating. AE-TECH uses this grade as an initial technical candidate for rigid or flexible PCBs and LCM/LCD edges. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
BeSIL N9339
BeSIL N9339 is a one-component neutral, moisture-cure RTV silicone. AE-TECH uses this grade as an initial technical candidate for electronics housings, control modules and connectors. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
BEEP 6113
BEEP 6113 is a two-component thermally conductive epoxy potting material. AE-TECH uses this grade as an initial technical candidate for automotive electronics, power tools, reactor and measurement equipment. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
Describe the application and technical requirements so AE-TECH can review the relevant technology and product scope.