BeGEL 8708 is a two-component addition-cure silicone gel. AE-TECH uses this grade as an initial technical candidate for igbt, junction box, control units and inverter. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
BeGEL 8708 is a two-component addition-cure silicone gel. AE-TECH uses this grade as an initial technical candidate for igbt, junction box, control units and inverter. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
Use the exact Product Code and product configuration when reviewing this item.
IC, sensors and semiconductor modules
Evaluate protecting sensitive components in the context of IC, sensors and semiconductor modules against the actual material, component, process and operating conditions before standardization.
IGBT, ECU, junction box or inverter
Evaluate electrical insulation within modules in the context of IGBT, ECU, junction box or inverter against the actual material, component, process and operating conditions before standardization.
Verify gel softness against the exact Product Code, product-specific documentation and actual application before selection.
Verify electrical requirements against the exact Product Code, product-specific documentation and actual application before selection.
Verify mixing and deaeration against the exact Product Code, product-specific documentation and actual application before selection.
Prepare the surface, mix and cure in accordance with the product-specific TDS, and test on the actual assembly before introducing the material into the process. Contact AE-TECH to check the SDS applicable to the product and region of use.
| Metric | Value |
|---|---|
| Configuration | A:B = 1:1 |
| Material system | Two-component addition-cure silicone gel |
| Product code | BeGEL 8708 |
This information is summarized from manufacturer technical and safety documentation for initial evaluation and does not replace confirmation under actual application conditions.
Review this product within the verified Product Group, compatibility and application context.
Silicone Gels for Modules and Sensors organizes verified products and supporting technical records for selection in the relevant manufacturing context.
Beginor provides silicone, epoxy, polyurethane and acrylic material technologies for electronics protection, thermal management, bonding and sealing.
7 Product Groups
AE-TECH helps electronics manufacturers evaluate encapsulation, conformal coating, thermal-management, bonding and sealing materials for component and module assembly.
AE-TECH helps manufacturers evaluate materials for bonding, thermal management, electronics protection, sealing and noise and vibration control based on the component, substrates and production conditions.
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