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ACOUSTICRYL™ AV-1220 Emulsion

Product

AV-1220

ACOUSTICRYL™ AV-1220 Emulsion

ACOUSTICRYL™ AV-1220 Emulsion belongs to the Acrylic Resins for Sound-Damping Coatings product group. It is an acrylic resin used to formulate water-based sound-damping coatings. Selection should begin with the actual component, materials, design and production conditions; specifications or compatibility from another Dow product must not be applied to this grade. This is a base resin for material manufacturers or formulators, not a finished coating for direct spray application.

Dow Mobility Acrylic Resins for Sound-Damping Coatings Protection and coating
ACOUSTICRYL™ AV-1420 Emulsion

Product

AV-1420

ACOUSTICRYL™ AV-1420 Emulsion

ACOUSTICRYL™ AV-1420 Emulsion belongs to the Acrylic Resins for Sound-Damping Coatings product group. It is an acrylic resin used to formulate water-based sound-damping coatings. Selection should begin with the actual component, materials, design and production conditions; specifications or compatibility from another Dow product must not be applied to this grade. This is a base resin for material manufacturers or formulators, not a finished coating for direct spray application.

Dow Mobility Acrylic Resins for Sound-Damping Coatings Protection and coating

Product

BECOAT 921L

BECOAT 921L

BECOAT 921L is a one-component, neutral, low-viscosity, solvent-free silicone conformal coating. AE-TECH uses this grade as an initial technical candidate for rigid or flexible PCBs and LCM/LCD edges. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Conformal Coatings for Circuit Boards Thermal management

Product

BECOAT 9060

BECOAT 9060

BECOAT 9060 is a one-component transparent conformal coating with a fluorescent indicator. AE-TECH uses this grade as an initial technical candidate for PCBs and control modules requiring coating-area inspection. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Conformal Coatings for Circuit Boards Thermal management

Product

BECOAT 9067

BECOAT 9067

BECOAT 9067 is a one-component solvent-containing, moisture-cure silicone conformal coating. AE-TECH uses this grade as an initial technical candidate for PCBs and control modules. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Conformal Coatings for Circuit Boards Thermal management

Product

BEEP 629

BEEP 629

BEEP 629 is a one-component solvent-free, heat-cure structural epoxy adhesive. AE-TECH uses this grade as an initial technical candidate for automotive electronics, pressure sensors, wiring and motor cores. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Epoxy Adhesives for Electronics Assembly Bonding

Product

BEEP 6102

BEEP 6102

BEEP 6102 is a two-component room-temperature-cure epoxy potting material. AE-TECH uses this grade as an initial technical candidate for electronic components and circuit boards. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Epoxy and Polyurethane Encapsulants Thermal management

Product

BEEP 6113

BEEP 6113

BEEP 6113 is a two-component thermally conductive epoxy potting material. AE-TECH uses this grade as an initial technical candidate for automotive electronics, power tools, reactor and measurement equipment. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Epoxy and Polyurethane Encapsulants Thermal management

Product

BEEP 6206

BEEP 6206

BEEP 6206 is a two-component transparent structural epoxy adhesive. AE-TECH uses this grade as an initial technical candidate for automotive electronics, pressure sensors, wiring and motor cores. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Epoxy Adhesives for Electronics Assembly Bonding

Product

BEEP 6212

BEEP 6212

BEEP 6212 is a two-component structural epoxy adhesive for metal bonding. AE-TECH uses this grade as an initial technical candidate for metal bonding, aluminum honeycomb panels and motor cores. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Epoxy Adhesives for Electronics Assembly Bonding

Product

BEEP 6225

BEEP 6225

BEEP 6225 is a two-component epoxy potting material for thermal requirements. AE-TECH uses this grade as an initial technical candidate for automotive electronics, power tools, reactor and measurement equipment. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Epoxy and Polyurethane Encapsulants Thermal management

Product

BEEP 6901

BEEP 6901

BEEP 6901 is a two-component solvent-free, heat-cure epoxy potting material. AE-TECH uses this grade as an initial technical candidate for sensors, heat-resistant wiring and automotive electronics. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Epoxy and Polyurethane Encapsulants Thermal management

Product

BEEP 6903

BEEP 6903

BEEP 6903 is a two-component solvent-free, heat-cure epoxy potting material. AE-TECH uses this grade as an initial technical candidate for sensors, heat-resistant wiring and automotive electronics. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Epoxy and Polyurethane Encapsulants Thermal management

Product

BeGEL 8708

BeGEL 8708

BeGEL 8708 is a two-component addition-cure silicone gel. AE-TECH uses this grade as an initial technical candidate for igbt, junction box, control units and inverter. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Silicone Gels for Modules and Sensors Thermal management

Product

BeGEL 8710-2

BeGEL 8710-2

BeGEL 8710-2 is a two-component transparent self-healing silicone gel. AE-TECH uses this grade as an initial technical candidate for semiconductor modules, igbt, ecu, ic and load-cell sensors. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Silicone Gels for Modules and Sensors Thermal management

Product

BeGEL 8715

BeGEL 8715

BeGEL 8715 is a two-component transparent silicone gel that is soft and self-healing. AE-TECH uses this grade as an initial technical candidate for power semiconductors, sensors, ecu and ic. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Silicone Gels for Modules and Sensors Thermal management

Product

BEPU 6127

BEPU 6127

BEPU 6127 is a two-component solvent-free polyurethane potting material that forms a soft encapsulant. AE-TECH uses this grade as an initial technical candidate for automotive sensors, switches, transformer and electrical equipment. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Epoxy and Polyurethane Encapsulants Thermal management

Product

BEPU 6608

BEPU 6608

BEPU 6608 is a two-component polyurethane potting material that cures at room temperature or with heat. AE-TECH uses this grade as an initial technical candidate for protective encapsulation and filling of electronic assemblies. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Epoxy and Polyurethane Encapsulants Thermal management

Product

BeSIL 8125

BeSIL 8125

BeSIL 8125 is a two-component low-viscosity silicone potting material. AE-TECH uses this grade as an initial technical candidate for electronic modules, power controllers and LED assemblies. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Silicone Encapsulants for Electronic Components Thermal management

Product

BeSIL 8230

BeSIL 8230

BeSIL 8230 is a two-component, addition-cure, thermally conductive RTV silicone. AE-TECH uses this grade as an initial technical candidate for electronic modules, power supplies and control units. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Silicone Encapsulants for Electronic Components Thermal management

Product

BeSIL 8230-1

BeSIL 8230-1

BeSIL 8230-1 is a two-component silicone with low hardness, low viscosity and stress-relief properties. AE-TECH uses this grade as an initial technical candidate for power converters, junction box and automotive electronic modules. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Silicone Encapsulants for Electronic Components Thermal management

Product

BeSIL 8230-3

BeSIL 8230-3

BeSIL 8230-3 is a two-component silicone gel encapsulant with low hardness and stress-relief properties. AE-TECH uses this grade as an initial technical candidate for inverter, converter, driver and junction box. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Silicone Encapsulants for Electronic Components Thermal management

Product

BeSIL 8230-15

BeSIL 8230-15

BeSIL 8230-15 is a two-component thermally conductive silicone potting material. AE-TECH uses this grade as an initial technical candidate for electronic modules, LED power supplies, battery assemblies and inverter. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Silicone Encapsulants for Electronic Components Thermal management

Product

BeSIL 9316

BeSIL 9316

BeSIL 9316 is a one-component thermally conductive RTV silicone adhesive. AE-TECH uses this grade as an initial technical candidate for power supplies, ecu, semiconductors and power transistors. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.

Beginor Silicone Adhesives and Sealants Bonding

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