BeSIL 8125 is a two-component low-viscosity silicone potting material. AE-TECH uses this grade as an initial technical candidate for electronic modules, power controllers and LED assemblies. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
BeSIL 8125 is a two-component low-viscosity silicone potting material. AE-TECH uses this grade as an initial technical candidate for electronic modules, power controllers and LED assemblies. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
PCB, control modules, power supplies or junction box
Evaluate electronic module encapsulation in the context of PCB, control modules, power supplies or junction box against the actual material, component, process and operating conditions before standardization.
Inverter, converter or power modules
Evaluate power electronics protection in the context of Inverter, converter or power modules against the actual material, component, process and operating conditions before standardization.
Verify gap-filling capability against the exact Product Code, product-specific documentation and actual application before selection.
Verify stress after curing against the exact Product Code, product-specific documentation and actual application before selection.
Verify curing process against the exact Product Code, product-specific documentation and actual application before selection.
Prepare the surface, mix and cure in accordance with the product-specific TDS, and test on the actual assembly before introducing the material into the process. Contact AE-TECH to check the SDS applicable to the product and region of use.
| Metric | Value |
|---|---|
| Configuration | A:B = 100:(10±3) |
| Material system | Two-component low-viscosity silicone potting material |
| Product code | BeSIL 8125 |
This information is summarized from manufacturer technical and safety documentation for initial evaluation and does not replace confirmation under actual application conditions.
Silicone Encapsulants for Electronic Components organizes verified products and supporting technical records for selection in the relevant manufacturing context.
Beginor provides silicone, epoxy, polyurethane and acrylic material technologies for electronics protection, thermal management, bonding and sealing.
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AE-TECH helps electronics manufacturers evaluate encapsulation, conformal coating, thermal-management, bonding and sealing materials for component and module assembly.
AE-TECH helps manufacturers evaluate materials for bonding, thermal management, electronics protection, sealing and noise and vibration control based on the component, substrates and production conditions.
Describe the application, operating conditions and technical issue so AE-TECH can review the product with you.
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