Manufacturing application
Thermal gap filling
Evaluate thermal gap filling in the context of Manufacturing application against the actual material, component, process and operating conditions before standardization.
Products
BESIL TCMP 8835
BESIL TCMP 8835 is a two-component liquid silicone gap filler that is soft and thixotropic. AE-TECH uses this grade as an initial technical candidate for power modules, communications equipment and computers. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
Primary function
What is this product used for?
BESIL TCMP 8835 is a two-component liquid silicone gap filler that is soft and thixotropic. AE-TECH uses this grade as an initial technical candidate for power modules, communications equipment and computers. Application should be based on the component structure, substrates, electrical and thermal requirements, and actual production conditions.
Verified applications
Suitable use contexts
Power electronics, vehicle electronics and communications equipment
electronic modules and pin
Evaluate this product for electronic modules and pin against the actual material, component, process and operating conditions before standardization.
Evaluation basis
Why evaluate this product?
Two-component liquid silicone gap filler that is soft and thixotropic
Before selection
Selection and operating conditions
Thermal gap
Verify thermal gap against the exact Product Code, product-specific documentation and actual application before selection.
Thermal conductivity and hardness
Verify thermal conductivity and hardness against the exact Product Code, product-specific documentation and actual application before selection.
Dispensing equipment
Verify dispensing equipment against the exact Product Code, product-specific documentation and actual application before selection.
Prepare the surface, mix and cure in accordance with the product-specific TDS, and test on the actual assembly before introducing the material into the process. Contact AE-TECH to check the SDS applicable to the product and region of use.
Verified source data
Key technical data
Technical characteristics
| Metric | Value |
|---|---|
| Configuration | A:B = 100:100 |
| Material system | Two-component liquid silicone gap filler that is soft and thixotropic |
| Key technical data | 3,5 W/mK |
| Product code | BESIL TCMP 8835 |
This information is summarized from manufacturer technical and safety documentation for initial evaluation and does not replace confirmation under actual application conditions.
Product group and brand
Thermal Transfer and Gap-Filling Materials
Thermal Transfer and Gap-Filling Materials organizes verified products and supporting technical records for selection in the relevant manufacturing context.
Beginor provides silicone, epoxy, polyurethane and acrylic material technologies for electronics protection, thermal management, bonding and sealing.
7 Product Groups
Directly related solutions
Electronics Protection and Assembly Solutions
AE-TECH helps electronics manufacturers evaluate encapsulation, conformal coating, thermal-management, bonding and sealing materials for component and module assembly.
Material Solutions for Automotive and Electric-Vehicle Manufacturing
AE-TECH helps manufacturers evaluate materials for bonding, thermal management, electronics protection, sealing and noise and vibration control based on the component, substrates and production conditions.
Discuss this product
Describe the application, operating conditions and technical issue so AE-TECH can review the product with you.
The online form is not available yet. Please contact AE-TECH directly.
Contact AE-TECH