Manufacturing application
ADAS and sensors
Electrically conductive bonding for grounding, bonding and interference control in ADAS modules.
Products
DOWSIL™ EC-8425 Electrically Conductive Adhesive
DOWSIL™ EC-8425 Electrically Conductive Adhesive belongs to the Silicone Adhesives, Sealants and Gasketing Materials product group. The product supports electrically conductive bonding for grounding, bonding and interference control in ADAS modules. Selection should begin with the actual component, materials, design and production conditions; specifications or compatibility from another Dow product must not be applied to this grade.
Primary function
What is this product used for?
DOWSIL™ EC-8425 Electrically Conductive Adhesive belongs to the Silicone Adhesives, Sealants and Gasketing Materials product group. The product supports electrically conductive bonding for grounding, bonding and interference control in ADAS modules. Selection should begin with the actual component, materials, design and production conditions; specifications or compatibility from another Dow product must not be applied to this grade.
Verified applications
Suitable use contexts
Electronic component application
Evaluate electronic component application in the context of Manufacturing application against the actual material, component, process and operating conditions before standardization.
Evaluation basis
Why evaluate this product?
Electrically conductive bonding for grounding, bonding and interference control in ADAS modules.
Documentation and availability for projects in Vietnam must be confirmed with AE-TECH.
Before selection
Selection and operating conditions
Application and substrates
Define the vehicle component, contacting materials, gap or joint design, and the required function.
Production process
Check the substrate, gap or flange design, dispensing method, curing mechanism and operating environment.
Documentation and testing
Review the technical documentation for the exact grade, then test it with the actual materials, equipment and production cycle.
Check the substrate, gap or flange design, dispensing method, curing mechanism and operating environment. Contact AE-TECH to confirm documentation, package format and availability for the project in Vietnam.
Verified source data
Key technical data
Technical characteristics
| Metric | Value |
|---|---|
| Configuration | Two-component |
| Listed mixing ratio | 1:1 |
| Listed thermal conductivity | 3.3 W/mK |
| Material type | Technical adhesive |
This information is summarized from manufacturer technical and safety documentation for initial evaluation and does not replace confirmation under actual application conditions.
Product group and brand
Silicone Adhesives, Sealants and Gasketing Materials
Silicone Adhesives, Sealants and Gasketing Materials organizes verified products and supporting technical records for selection in the relevant manufacturing context.
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11 Product Groups
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