Products

DOWSIL™ TC-6040 Thermal Conductive Encapsulant

DOWSIL™ TC-6040 Thermal Conductive Encapsulant belongs to the Electronic Protection Gels and Encapsulants product group. The product supports protective encapsulation and heat transfer for OBCs, DC/DC converters and EV power electronics. Selection should begin with the actual component, materials, design and production conditions; specifications or compatibility from another Dow product must not be applied to this grade.

Product image: DOWSIL™ TC-6040 Thermal Conductive Encapsulant
Primary function

What is this product used for?

DOWSIL™ TC-6040 Thermal Conductive Encapsulant belongs to the Electronic Protection Gels and Encapsulants product group. The product supports protective encapsulation and heat transfer for OBCs, DC/DC converters and EV power electronics. Selection should begin with the actual component, materials, design and production conditions; specifications or compatibility from another Dow product must not be applied to this grade.

Verified applications

Suitable use contexts

Manufacturing application

Electronic component application

Evaluate electronic component application in the context of Manufacturing application against the actual material, component, process and operating conditions before standardization.

Evaluation basis

Why evaluate this product?

Protective encapsulation and heat transfer for OBCs, DC/DC converters and EV power electronics.

Material type: Thermally conductive encapsulation material.

Documentation and availability for projects in Vietnam must be confirmed with AE-TECH.

Before selection

Selection and operating conditions

Application and substrates

Define the vehicle component, contacting materials, gap or joint design, and the required function.

Production process

Check viscosity, filling behavior, mixing ratio, cure temperature, softness, and heat-transfer or insulation requirements.

Documentation and testing

Review the technical documentation for the exact grade, then test it with the actual materials, equipment and production cycle.

Check viscosity, filling behavior, mixing ratio, cure temperature, softness, and heat-transfer or insulation requirements. Contact AE-TECH to confirm documentation, package format and availability for the project in Vietnam.

Verified source data

Key technical data

Technical characteristics

Metric Value
Configuration Two-component
Listed thermal conductivity 4.0 W/mK
Listed hardness 32 Shore A
Material type Thermally conductive encapsulant

This information is summarized from manufacturer technical and safety documentation for initial evaluation and does not replace confirmation under actual application conditions.

Discuss this product

Describe the application, operating conditions and technical issue so AE-TECH can review the product with you.

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