Manufacturing application
Electronic component application
Evaluate electronic component application in the context of Manufacturing application against the actual material, component, process and operating conditions before standardization.
Products
DOWSIL™ 1-4174 Thermally Conductive Adhesive
DOWSIL™ 1-4174 Thermally Conductive Adhesive belongs to the Thermal Transfer and Gap-Filling Materials product group. The product supports bonding and heat transfer for ICs, lids, housings, baseplates and heat sinks. Selection should begin with the actual component, materials, design and production conditions; specifications or compatibility from another Dow product must not be applied to this grade.
Primary function
What is this product used for?
DOWSIL™ 1-4174 Thermally Conductive Adhesive belongs to the Thermal Transfer and Gap-Filling Materials product group. The product supports bonding and heat transfer for ICs, lids, housings, baseplates and heat sinks. Selection should begin with the actual component, materials, design and production conditions; specifications or compatibility from another Dow product must not be applied to this grade.
Verified applications
Suitable use contexts
Evaluation basis
Why evaluate this product?
Bonding and heat transfer for ICs, lids, housings, baseplates and heat sinks.
Documentation and availability for projects in Vietnam must be confirmed with AE-TECH.
Before selection
Selection and operating conditions
Application and substrates
Define the vehicle component, contacting materials, gap or joint design, and the required function.
Production process
Check thermal conductivity, gap, post-cure hardness, dispensing method, working time and production cycle.
Documentation and testing
Review the technical documentation for the exact grade, then test it with the actual materials, equipment and production cycle.
Check thermal conductivity, gap, post-cure hardness, dispensing method, working time and production cycle. Contact AE-TECH to confirm documentation, package format and availability for the project in Vietnam.
Verified source data
Key technical data
Technical characteristics
| Metric | Value |
|---|---|
| Configuration | Two-component |
| Listed mixing ratio | 1:1 |
| Listed thermal conductivity | 1.8 W/mK |
| Material type | Thermally conductive adhesive |
This information is summarized from manufacturer technical and safety documentation for initial evaluation and does not replace confirmation under actual application conditions.
Product group and brand
Thermal Transfer and Gap-Filling Materials
Thermal Transfer and Gap-Filling Materials organizes verified products and supporting technical records for selection in the relevant manufacturing context.
Dow Mobility materials cover EV batteries, automotive electronics, connectors, NVH control, sealing, hoses and weatherseals.
11 Product Groups
Directly related solutions
Material Solutions for Automotive and Electric-Vehicle Manufacturing
AE-TECH helps manufacturers evaluate materials for bonding, thermal management, electronics protection, sealing and noise and vibration control based on the component, substrates and production conditions.
Discuss this product
Describe the application, operating conditions and technical issue so AE-TECH can review the product with you.
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