Manufacturing application
ADAS and sensors
Thermal gap filling for ADAS and high-frequency electronics.
Products
DOWSIL™ TC-4083 Dispensable Thermal Pad
DOWSIL™ TC-4083 Dispensable Thermal Pad belongs to the Thermal Transfer and Gap-Filling Materials product group. Thermal gap filling for ADAS and high-frequency electronics. Selection should begin with the actual component, materials, design and production conditions; specifications or compatibility from another Dow product must not be applied to this grade.
Primary function
What is this product used for?
DOWSIL™ TC-4083 Dispensable Thermal Pad belongs to the Thermal Transfer and Gap-Filling Materials product group. Thermal gap filling for ADAS and high-frequency electronics. Selection should begin with the actual component, materials, design and production conditions; specifications or compatibility from another Dow product must not be applied to this grade.
Verified applications
Suitable use contexts
Electronic component application
Evaluate electronic component application in the context of Manufacturing application against the actual material, component, process and operating conditions before standardization.
Evaluation basis
Why evaluate this product?
Thermal gap filling for ADAS and high-frequency electronics.
Documentation and availability for projects in Vietnam must be confirmed with AE-TECH.
Before selection
Selection and operating conditions
Application and substrates
Define the vehicle component, contacting materials, gap or joint design, and the required function.
Production process
Check thermal conductivity, gap, post-cure hardness, dispensing method, working time and production cycle.
Documentation and testing
Review the technical documentation for the exact grade, then test it with the actual materials, equipment and production cycle.
Check thermal conductivity, gap, post-cure hardness, dispensing method, working time and production cycle. Contact AE-TECH to confirm documentation, package format and availability for the project in Vietnam.
Verified source data
Key technical data
Technical characteristics
| Metric | Value |
|---|---|
| Configuration | Two-component |
| Listed mixing ratio | 1:1 |
| Listed thermal conductivity | 10.0 W/mK |
| Listed hardness | 58 Shore 00 |
| Material type | Thermally conductive gap-filling material |
This information is summarized from manufacturer technical and safety documentation for initial evaluation and does not replace confirmation under actual application conditions.
Product group and brand
Thermal Transfer and Gap-Filling Materials
Thermal Transfer and Gap-Filling Materials organizes verified products and supporting technical records for selection in the relevant manufacturing context.
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11 Product Groups
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AE-TECH helps manufacturers evaluate materials for bonding, thermal management, electronics protection, sealing and noise and vibration control based on the component, substrates and production conditions.
Discuss this product
Describe the application, operating conditions and technical issue so AE-TECH can review the product with you.
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